Heat Dissipative Materials
We offer various heat dissipative materials such as Phenolic molding compounds, Epoxy molding compounds and Epoxy liquid resin.
Epoxy Resin Copper-clad Laminates SUMILITE® ELC
Double sided Epoxy resin copper-clad laminate suitable for wide range of applications.
Aluminum Based Materials for PCB SUMILITE® ALC
High-fever conduction, low heat thermal resistance, high electric strength, and a halogen freelancer are given.
