We embody the dreams of our customers and work together with them from developing to evaluating.
Sumitomo Bakelite's technology is reflected not only in our materials, but also in our customers' applications and processes.
・Back-end development support for advanced semiconductors
・Support for mobility and new applications (electronic components, industry, etc.)
IT Materials Division
Become a materials solutions provider
that gives dreams
for the future of electronics and mobility.
Latest information
- 2024/10/28ProductsCompletion Ceremony for New plant of Sumitomo Bakelite (Suzhou) Co., Ltd. for Epoxy Resin Molding Compounds for Encapsulation of Semiconductor Devices
- 2024/08/01ProductsSumitomo Bakelite Co., Ltd. starts sample shipment of high thermal conductive silver sintering paste for next-generation power semiconductors
- 2024/03/13ProductsCompletion ceremony of the new plant for Encapsulation of Semiconductor Devices at Sumitomo Bakelite (Taiwan) Co., Ltd. section.section-block.-even
The strengths of Sumitomo Bakelite
Point01
Lineup for all packages
in semiconductor package manufacturing
As a provider of materials solutions,
we offer a wide range of support to the supply chain
from the upstream to the downstream of the semiconductor manufacturing.
Semiconductor
manufacturing processes
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Pre-process
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Photosensitive materials for semiconductor wafer protection. SUMIRESIN COAT "CRC" are mainly positive photosensitive materials that do not require solvents and are environmentally friendly.
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Dicing
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A film that prevents chips from scattering during the dicing process. It has excellent antistatic properties and is widely used in the dicing process for wafers with fine patterns.
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Package Substrate Creation
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Low expansion, low dimensional change and high stiffness packaging substrate material that contributes to smaller and thinner packages. Contributes to the miniaturization of components in smartphones.
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Die bonding
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Die bonding paste for a variety of packages. Used for bonding chips and ensuring thermal diffusion.
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Encapsulation
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Epoxy encapsulants for semiconductors that can be used in a variety of applications and package forms. We also respond to the evolution of molding processes as semiconductors evolve.
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Delivery
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This tape is used to transport semiconductor packages and electronic components to the surface mount process. Our products have excellent antistatic properties.
Point02
Global expansion
We have factories and laboratories in major markets around the world,
enabling us to develop original products
that meet the needs of each region and respond quickly to customer requests.
Open Lab (Open Labs)
The Sumitomo Bakelite Group supports the "imagination" and "creativity" of its customers
and operates open laboratories (customer laboratories) in Japan, Asia, Europe and the United States
where actual molding operations and structural and process studies can be conducted.
Point03
R&D capabilities to respond
to the evolution of semiconductor packaging
Collaborate with equipment manufacturers, raw material component manufacturers,
universities, and consortia to accelerate development.
We will provide products that respond to market information and customer needs.
Use Cases
Sumitomo Bakelite's
Solution
We are introducing Sumitomo Bakelite's diverse solutions on our special website.
New solutions are being created not only from Sumitomo Bakelite's problem-solving proposals,
but also from proposals for customer utilization methods.
