Pastes for Die Bonding
SUMIRESIN EXCEL®CRM

Products

In the domestic market of die attach pastes, Sumitomo Bakelite Co., Ltd. has kept the leading position with the highest market share while also actively developing overseas markets.
From 3 manufacturing bases, in Japan (Utsunomiya city), China and Singapore, we can provide high level and high quality products with an on-time delivery system.
Sumitomo Bakelite Co., Ltd. supplies not only conventional packaging materials but also materials proactively developed for BGAs, CSPs, LED and other advanced packages.

Plants

  • Utsunomiya Plant
  • Sumitomo Bakelite (Suzhou) Co., Ltd.
  • Sumitomo Bakelite Singapore Pte. Ltd.

Laboratory

  • Information & Telecommunication materials research Laboratory (Japan)
  • Information & Telecommunication materials research Laboratory (China)
  • Information & Telecommunication materials research Laboratory (Singapore)

Video Contents

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Video contents of IT Materials

Features

Higher Reliability

The CRM series are one-component type of die attach pastes with high reliability for all semiconductor packages and LED packages.

Applications

Electrical and Electronic Equipment

Semiconductors

Bonding of IC chips with lead frames and organic substrates, stacking of IC chips.

LED Package

Bonding of LED chips with lead frames and organic substrates.

Specifications

Grade Features Main Applications
CRM-1030 series Standard oven cure SOT, DIP, SO, PLCC, QFP
CRM-1060 series Standard in-line cure (Rapid cure) SOT, DIP, SO, PLCC, QFP
CRM-1070 series Low stress DIP, SO, PLCC, QFP, L/TQFP, TSOP, LF CSP
CRM-1080 series High adhesion
High electrical conductivity		 Little Chip (SOT, LED etc.)
CRM-1100 series Insulation SOT, DIP, SO, PLCC, QFP, L/TQFP, TSOP, LF CSP
CRM-1200 series High thermal conductive adhesive
Thermal interface material (TIM)		 DIP, SO, PLCC, QFP, L/TQFP, TSOP
CRM-1500 series For laminate PKG PBGA, FPBGA, FCBGA
CRM-1700 series Radical cure type
Low stress		 DIP, SO, PLCC, QFP, L/TQFP, TSOP, LF CSP
CRM-1800 seeries Super high thermal conductivity
Ag sintering		 Discrete, SO, QFP, L/TQFP, LF CSP

Examples

BGA, QFN, LED etc.

Lead frame package

Area alley package