High Thermally-conductive
Epoxy Molding Compound

High Thermally-conductive Epoxy  Molding Compound

High thermal conductive,
high insulation,
good mold-ability,
good filling performance

Characteristics

Develop high thermal conductive mold compound for several packages.

Application example

Power module
Mold under fill (MUF)

Core technology

Establish surface treatment and filler distribution design of alumina for high thermal conductive.
surface

Example

Ref Development
Filler w/o treat w/ treat
Filler content 93％ 93％
Thermal conductive 5W/mK 7W/mK

 

Surface treatment reduce thermal resistance of filler interface and improve thermal conductivity.