Characteristics

• Full sintering
  Wider process capability (Press type / Non-Press type, Air curing / N2 curing)
  
  
• Semi sintering
  Combine high thermal conductivity and excellent adhesion on bare Si with low filler loading

Core technology

Establish unique sintering technology with micro Ag

	Micro Ag	Nano Ag
Size	0.5～5μm	10～100nm
Health impact	Low	High
Content of organic component	Low	High
Agglomeration risk	Low	High
Sintering effect	Low	High

[Micro Ag + Sinterpromoting technology]

Semi sintering

Full sintering
Achievement of
Ag high sintering

Line up

Application example

Discrete, High Power LED, Power IC, Power module (Si IGBT, SiC, GaN)