Epoxy Molding Compound with Low Dk/Df
Realization of low Dk/Df by introduction of
low polar groups into epoxy resin cross-linking reaction
Featuers
| EME-G314 | |||
|---|---|---|---|
| Flexural strength | RT | N/mm2 | 150 |
| Flexural modulus | RT | N/mm2 | 23600 |
| Tg | - | degC | 110 |
| Dk | 1GHz | - | 3.5 |
| Df | 1GHz | - | 0.004 |
These typical values on this table are not guaranteed.
Application example
RF module
Core technology
