Thermosetting Molding Compounds
for 3D-circuit MID [Molded Interconnect Device] (Under Development)

Contributing to Downsizing, Light-weighting, Number of parts reduction and process reduction Contributing to High Reliability 3D-circuit MID by using Thermosetting resin.

Advantage

  • Possible to form fine 3D circuit
  • Possible for soldering
  • Better Design Flexibility
  • Can be used under high temperature environment
  • Maintain insulation under high temperature and humidity environment
  • High reliability with high heat resistance and low CTE
Items EME-L (Epoxy) PM-L (Phenolic)
Applications semiconductor package mechanical parts