Required Characteristics and Key Technologies

High Tg and Low CTE Material - Excellent thermostability.
For high heat-resistant Power Modules and Automotive applications.

Features

Thermostability Epoxy Resin; High Tg, LowCTE

For SiC/GaN Power Modules smaller and lighter.

Features

Cast Molding Products for Power Modules; excellent insulation, heat dissipation, thermostablity and adhesion (Under development)

Liquid property

Item	Condition /Unit	Current products		Newly developed products
		ECR-2222K /ECH-222G	ECR-1004 /ECH-4	Tg210℃
Mixing Ratio	Epoxy/Hardner	100/100	100/100	100/100
Mixture Viscosity	60℃ (Pa・s)	0.5	0.5	1.5
Gel Time	150℃ (s)	300	300	400〜500

Cured product property

5 5

Item	Condition /Unit	Current products		Newly developed products
		ECR-2222K /ECH-222G	ECR-1004 /ECH-4	Tg210℃
Curing condition		100℃/2h +140℃/2h	100℃/2h +140℃/2h	150℃/1h +180℃/2h
Flexural Strength	RT(MPa)	130	130	130
Flexural Modulus	RT(GPa)	9	9	17
Dielectric Strength	RT(kV/mm)	35	35	33
Tg	TMA(℃)	125	140	210
α＜Tg	TMA(ppm)	40	40	15
Flammability	UL94(3.2mmt)	-	-	HB equiv.

：	Improved heat cycle and power cycle performance by High Tg and low CTE, especially using Tg210C product.
：	Above characteristic values are representative values, not guaranteed. The characteristics of the developed product are subject to change.

Applications

Ignition Coils

Power Modules