High Thermal Conductive Sintering Paste

Thermal Conductivity is Enhanced by Sintering Technology.

Advantage

  • Full Sintering →Various processes are available-Press/Non-Press, Air/N2
  • Semi Sintering →High thermal conductivity with low silver content & high adhesion to bare Si chip

Core technology

Establish unique sintering technology with micro Ag
Item Micro Ag Nano Ag
Size 0.5-5μm 10-100nm
Health impact Low High
Content of organic component Low High
Agglomeration risk Low High
Sintering effect Low High
[Micro Ag + Sinter-promoting technology]

Semi sintering

Full sintering
Achievement of
Ag high sintering

Line up

Application example

Discrete, High Power LED, Power IC, Power module (Si IGBT, SiC, GaN)