* Suitable not only for drive motors, but also for auxiliary motors and axial gap motors!
Insulating paper + liquid resin immersion, etc.
Encapsule with epoxy molding compound
No filling of coil gap
Filling of coil gap
Efficiently dissipation of the heat generated in the coil → Coil temperature reduction
Simulation conditions
Inside heat:110 [W/slot]
Coolant:Ethylene glycol water 50%
Input flow rate:0.6 (kg/min)/slot]
Liquid temperature:65 [℃]
Around coil : No filling >200°C
Filling with 1W/mK Compound 164°C